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Anglický jazyk
Development of Sub-mm Wave Flip-Chip Interconnect
Autor: Sirinpa Monayakul
With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500... Viac o knihe
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O knihe
With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz.
Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.
- Vydavateľstvo: Cuvillier
- Rok vydania: 2016
- Formát: Paperback
- Rozmer: 210 x 148 mm
- Jazyk: Anglický jazyk
- ISBN: 9783736994102
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