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Anglický jazyk
Failure Modes and Mechanisms in Electronic Packages
Autor: Puligandla Viswanadham
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures... Viac o knihe
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O knihe
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
- Vydavateľstvo: Springer US
- Rok vydania: 2012
- Formát: Paperback
- Rozmer: 235 x 155 mm
- Jazyk: Anglický jazyk
- ISBN: 9781461377634
Nemecký jazyk 
