• Anglický jazyk

MEMS Packaging Technologies and 3D Integration

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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one... Viac o knihe

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O knihe

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

  • Vydavateľstvo: MDPI AG
  • Rok vydania: 2022
  • Formát: Hardback
  • Rozmer: 250 x 175 mm
  • Jazyk: Anglický jazyk
  • ISBN: 9783036542584

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