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Anglický jazyk
MEMS Packaging Technologies and 3D Integration
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one... Viac o knihe
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O knihe
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
- Vydavateľstvo: MDPI AG
- Rok vydania: 2022
- Formát: Hardback
- Rozmer: 250 x 175 mm
- Jazyk: Anglický jazyk
- ISBN: 9783036542584