-
Anglický jazyk
Reliability Technology for Integrated Circuit Packaging
Autor: Bin Zhou
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality,... Viac o knihe
Predpokladaný dátum vydania: 17.2.2026
158.39 €
bežná cena: 175.99 €
O knihe
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
- Vydavateľstvo: Springer-Verlag GmbH
- Rok vydania: 2026
- Formát: Hardback
- Rozmer: 235 x 155 mm
- Jazyk: Anglický jazyk
- ISBN: 9789819538843
Nemecký jazyk 
